The report titled “Quad-Flat-No-Lead Packaging Market: Global Industry Analysis (2012-2016) and Opportunity Assessment (2017-2027)” covers a wide angle of the global market with the help of a detailed market segmentation.

The research analysis also discusses various options for quad-flat-no-lead packaging, trends that are affecting the global market, significant drivers that are fueling its growth, as well as difficulties that will adversely impact the market's revenue growth. The research report includes historical data as well as market forecasts for the following six years.

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Global Quad-Flat-No-Lead Packaging Market: Segmental Snapshot

The global quad-flat-no-lead packaging market is segmented on the basis of type, QFN variants, application and by region.

  • By type, the plastic moulded QFNs segment is expected to reflect high market attractiveness and is the largest segment. The plastic moulded QFNs segment is estimated to reach a value higher than US$ 180 Bn by the end of the year of forecast thus dominating the global market. Air-cavity QFNs segment is projected to grow at a higher pace in the coming years.
  • By QFN variant, the quad-flat-no-lead segment is anticipated to reach a noteworthy valuation by the end of the assessment period. The ultrathin quad-flat-no-lead segment is projected to grow at the fastest rate to register a CAGR of 14.4% throughout the period of assessment.
  • By application, the radio frequency devices segment is estimated to be valued at around US$ 26 Bn in 2017 and is likely to lead the global market. The wearable devices segment is projected to register the fastest growth rate of 0% owing to increased use of quad-flat-no-lead packaging in wearable devices.
  • By region, Asia Pacific excluding Japan reflects high growth potential. The quad-flat-no-lead packaging market in Asia Pacific excluding Japan is projected to grow at the highest rate and is estimated to be the largest among all other regional markets, thus dominating the global market.

Global Quad-Flat-No-Lead Packaging Market: Competitive Assessment

In a separate chapter, the research report on the global market for quad-flat, lead-free packaging analyses key competitors and provides vendor insights. This chapter contains information on significant market participants, including NXP Semiconductor, Fujitsu Ltd., Toshiba Corporation, Texas Instruments, Microchip Technology Inc., STATS ChipPAC Pte. Ltd., ASE Group, Amkor Technology, UTAC Group, Linear Technology Corporation, Henkel AG & Co., and Broadcom Limited.

Market Segmentation

By Type

  • Air-Cavity QFNs
  • Plastic-moulded QFNs

By QFN Variants

  • Very thin quad flat no-lead (VQFN)
  • Ultrathin quad flat no-lead (UQFN)
  • Quad flat no-lead (QFN)
  • Others

By Applications

  • Radio Frequency Devices
  • Wearable Devices
  • Portable Devices
  • Others

By Region

  • North America
  • Latin America
  • Western Europe
  • Eastern Europe
  • APEJ
  • Japan
  • MEA